The University of Savoie Mont Blanc and its Institute of Microelectronics, Electromagnetism, and Photonics – Microwave and Characterization Laboratory (IMEP-LAHC) will host approximately 100 researchers and R&D engineers from June 18 to 21, 2019, at the Le Manège Convention Center in Chambéry for the 23rd edition of the international conference “Signal and Power Integrity” (SPI).
These researchers, hailing from the U.S., Asia, and across Europe, are proposing new technological solutions and mathematical methods to improve the quality and speed of signals transmitted over ultra-high-speed connections. The applications for the general public are very concrete and, of course, numerous in our now “almost entirely digital” society. Indeed, these scientific advances will be used in the next generation of smartphones, supercomputers, multimedia devices, massive data centers… and soon in all the connected devices you’ll be using!
Grégory Houzet, a young assistant professor at the IMEP-LAHC laboratory, is organizing this event with the help of his colleagues Thierry Lacrevaz and Bernard Fléchet. Over the course of these few days, they will welcome researchers from around the world, lead discussions, and organize presentations of the latest findings from these researchers.
This event will also provide the University of Savoie Mont Blanc with an opportunity to raise its profile among international stakeholders in the field and to forge new connections with a view to future collaborations.
[View the program for the "Signal and Power Integrity" International Conference]
Learn more
